Display device

ABSTRACT

A scan line to which a selection signal or a non-selection signal is input from its end, and a transistor in which a clock signal is input to a gate, the non-selection signal is input to a source, and a drain is connected to the scan line are provided. A signal input to the end of the scan line is switched from the selection signal to the non-selection signal at the same or substantially the same time as the transistor is turned on. The non-selection signal is input not only from one end but also from both ends of the scan line. This makes it possible to inhibit the potentials of portions in the scan line from being changed at different times.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an object, a method, or a manufacturingmethod. In addition, the present invention relates to a process, amachine, manufacture, or a composition of matter. In particular, oneembodiment of the present invention relates to a semiconductor device, adisplay device, a light-emitting device, a driving method thereof, or amanufacturing method thereof. In particular, one embodiment of thepresent invention relates to an active matrix display device.

2. Description of the Related Art

In the active matrix display device, a plurality of pixels are arrangedin matrix. Each of the pixels displays a specific color in response toan image signal, which allows the whole display device to display adesired image.

In each of the pixels, a transistor for rewriting the image signal isprovided. A gate of the transistor is connected to a scan line. Thepotential of the scan line is controlled to control switching of thetransistor. Note that the scan line is connected to the gates of thetransistors included in the plurality of pixels arranged in a specificrow. That is, in the active matrix display device, rewriting of theimage signal is performed for each specific row.

In the active matrix display device, the number of scan lines is thesame as the number of rows of the plurality of pixels arranged inmatrix. Scan line driver circuits that control the potentials of thescan lines are provided in the active matrix display device. The scanline driver circuits can be collectively provided on one side of theplurality of pixels arranged in matrix; alternatively, the scan linedriver circuits can be separately provided (a first scan line drivercircuit and a second scan line driver circuit can be provided) on theboth sides thereof (see Patent Documents 1 and 2).

REFERENCE Patent Document

-   [Patent Document 1] U.S. Pat. No. 8,462,098-   [Patent Document 2] United States Published Patent Application No.    2012-0062528

SUMMARY OF THE INVENTION

In a scan line, influence of wiring resistance and parasitic capacitancebecomes obvious easily. Specifically, because the scan line extendsalong a plurality of pixels arranged in a specific row, the total lengthof the scan line is necessarily increased and wiring resistance iseasily increased. The scan line intersects with a plurality of signallines (i.e., wirings serving as image signal input paths of the pixels)and are connected to gates of a plurality of transistors. For thisreason, parasitic capacitance generated at intersections with the signallines and gate capacitance of the transistors connected to the scan lineare added to the scan line; thus, the parasitic capacitance is easilyincreased. In addition, in the case where a display device is increasedin size and the number of pixels is increased, the influence is furtherincreased. This is because the total length of the scan line is furtherincreased with an increase in the size of the display device, and thenumber of signal lines intersecting with the scan line and the number oftransistors connected to the scan line are increased with an increase inthe number of pixels in the display device.

Here, when the wiring resistance and the parasitic capacitance areincreased, a problem might occur in the display device. Specifically,when a signal is input to the scan line, the potential of a portionwhere the signal is input is changed, and then the potential of aportion apart from the input portion is changed. That is, in the scanline, depending on the portions, the potentials are changed at differenttimes. The time lag is increased in proportion to the wiring resistanceand the parasitic capacitance. Thus, increases in the wiring resistanceand the parasitic capacitance in the scan line increases the time lag inswitching the plurality of transistors whose gates are connected to thescan line. Consequently, the problem might be caused in the displaydevice.

Note that the expression “time lag in switching transistors” refers tothe following two cases: a case where the transistors are turned on atdifferent times and a case where the transistors are turned off atdifferent times. In the active matrix display device, in particular, theproblem is likely to occur in the latter case. This is because when thetransistors are turned off at different times, probability that an imagesignal different from a desired image signal is input to the pixel isincreased.

In view of the above, an object of one embodiment of the presentinvention is to inhibit the potentials of portions in a scan line frombeing changed at different times. Another object of one embodiment ofthe present invention is to inhibit a plurality of transistors whosegates are connected to a scan line from being switched at differenttimes. Another object of one embodiment of the present invention is toreduce a problem occurring in a display device. Another object of oneembodiment of the present invention is to provide a novel displaydevice. Note that one embodiment of the present invention aims toachieve at least one of the above objects. The descriptions of theseobjects do not disturb the existence of other objects. Other objects areapparent from and can be derived from the description of thespecification, the drawings, the claims, and the like.

The main point of one embodiment of the present invention is to input anon-selection signal not only from one end but also from both ends of ascan line when a signal input to the scan line is switched from aselection signal to the non-selection signal. Note that in thisspecification, the “selection signal” refers to a signal for turning ona transistor whose gate is connected to a scan line, and the“non-selection signal” refers to a signal for turning off thetransistor.

An example of one embodiment of the present invention is a displaydevice including a scan line to which a selection signal or anon-selection signal is input from its end, and a transistor in which aclock signal is input to a gate and the non-selection signal is input toa source. The other end of the scan line is electrically connected to adrain of the transistor. A signal input to the scan line from its end isswitched from the selection signal to the non-selection signal at thesame or substantially the same time as the transistor is turned on.

In the display device of one embodiment of the present invention, thenon-selection signal is input to the scan line not only from its end butalso from its both ends. This makes it possible to inhibit thepotentials of portions in the scan line from being changed at differenttimes. In addition, this makes it possible to inhibit a plurality oftransistors whose gates are connected to the scan line from beingswitched at different times. Consequently, it is possible to reduce aproblem that occurs in the display device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A, 1B, and 1D illustrate configuration examples of a displaydevice, and FIGS. 1C and 1E illustrate signal waveforms.

FIG. 2A illustrates a configuration example of a display device, andFIG. 2B illustrates signal waveforms.

FIG. 3 illustrates a configuration example of a display device.

FIG. 4A illustrates a specific example of a display device, and FIG. 4Billustrates a configuration example of a pixel.

FIG. 5 illustrates a configuration example of a scan line drivercircuit.

FIG. 6A illustrates waveforms of clock signals, and FIG. 6B illustratesa pulse output circuit.

FIG. 7A illustrates a configuration example of a pulse output circuit,and FIGS. 7B and 7C illustrate signal waveforms and changes in thepotentials of nodes.

FIG. 8A illustrates a configuration example of a scan line drivercircuit, and FIG. 8B illustrates signal waveforms.

FIG. 9 illustrates a configuration example of a scan line drivercircuit.

FIG. 10 illustrates an example of a display module.

FIG. 11A illustrates an example of a mobile phone, and FIG. 11Billustrates an example of a bangle display device.

FIGS. 12A and 12B illustrate an example of a portable device.

DETAILED DESCRIPTION OF THE INVENTION

Embodiments of the present invention will be described below in detail.Note that the present invention is not limited to the description below,and a variety of changes can be made without departing from the spiritand scope of the present invention. Therefore, the present invention isnot construed as being limited to the description given below.

In this specification and the like, when it is explicitly described thatX and Y are connected, the case where X and Y are electricallyconnected, the case where X and Y are functionally connected, and thecase where X and Y are directly connected are included therein.Accordingly, another element may be provided between elements having aconnection relation illustrated in drawings and texts, withoutlimitation on a predetermined connection relation, for example, theconnection relation illustrated in the drawings and the texts.

Here, X and Y each denote an object (e.g., a device, an element, acircuit, a wiring, an electrode, a terminal, a conductive film, a layer,or the like).

An example of the case where X and Y are directly connected is the casewhere an element that allows an electrical connection between X and Y(e.g., a switch, a transistor, a capacitor, an inductor, a resistor, adiode, a display element, a light-emitting element, and a load) is notconnected between X and Y, and X and Y are connected without the elementthat allows the electrical connection between X and Y providedtherebetween.

In an example of the case where X and Y are electrically connected, oneor more elements that allows an electrical connection between X and Y(e.g., a switch, a transistor, a capacitor, an inductor, a resistor, adiode, a display element, a light-emitting element, or a load) can beconnected between X and Y. A switch is controlled to be on or off. Thatis, the switch is conducting or not conducting (is turned on or off) todetermine whether current flows therethrough or not. Alternatively, theswitch has a function of selecting and changing a current path. Notethat the case where X and Y are electrically connected includes the casewhere X and Y are directly connected.

For example, in the case where X and Y are functionally connected, oneor more circuits that allows a functional connection between X and Y(e.g., a logic circuit such as an inverter, a NAND circuit, or a NORcircuit; a signal converter circuit such as a DA converter circuit, anAD converter circuit, or a gamma correction circuit; a potential levelconverter circuit such as a power supply circuit (e.g., a step-upcircuit or a step-down circuit) or a level shifter circuit for changingthe potential level of a signal; a voltage source; a current source; aswitching circuit; an amplifier circuit such as a circuit that canincrease signal amplitude, the amount of current, or the like, anoperational amplifier, a differential amplifier circuit, a sourcefollower circuit, or a buffer circuit; a signal generation circuit; amemory circuit; and/or a control circuit) can be connected between X andY. When a signal output from X is transmitted to Y, it can be said thatX and Y are functionally connected even if another circuit is providedbetween X and Y. Note that the case where X and Y are functionallyconnected includes the case where X and Y are directly connected and thecase where X and Y are electrically connected.

Note that in this specification and the like, an explicit description “Xand Y are electrically connected” means that X and Y are electricallyconnected (i.e., the case where X and Y are connected with anotherelement or another circuit provided therebetween), X and Y arefunctionally connected (i.e., the case where X and Y are functionallyconnected with another circuit provided therebetween), and X and Y aredirectly connected (i.e., the case where X and Y are connected withoutanother element or another circuit provided therebetween). That is, inthis specification and the like, the explicit description “X and Y areelectrically connected” is the same as the description “X and Y areconnected”.

Note that, for example, the case where a source (or a first terminal orthe like) of a transistor is electrically connected to X through (or notthrough) Z1 and a drain (or a second terminal or the like) of thetransistor is electrically connected to Y through (or not through) Z2,or the case where a source (or a first terminal or the like) of atransistor is directly connected to one part of Z1 and another part ofZ1 is directly connected to X while a drain (or a second terminal or thelike) of the transistor is directly connected to one part of Z2 andanother part of Z2 is directly connected to Y, can be expressed by usingany of the following expressions.

The expressions include, for example, “X, Y, a source (or a firstterminal or the like) of a transistor, and a drain (or a second terminalor the like) of the transistor are electrically connected to each other,and X, the source (or the first terminal or the like) of the transistor,the drain (or the second terminal or the like) of the transistor, and Yare electrically connected to each other in this order”; “a source (or afirst terminal or the like) of a transistor is electrically connected toX, a drain (or a second terminal or the like) of the transistor iselectrically connected to Y, and X, the source (or the first terminal orthe like) of the transistor, the drain (or the second terminal or thelike) of the transistor, and Y are electrically connected to each otherin this order”; and “X is electrically connected to Y through a source(or a first terminal or the like) and a drain (or a second terminal orthe like) of a transistor, and X, the source (or the first terminal orthe like) of the transistor, the drain (or the second terminal or thelike) of the transistor, and Y are provided to be connected in thisorder”. When the connection order in a circuit configuration is definedby an expression similar to the above examples, a source (or a firstterminal or the like) and a drain (or a second terminal or the like) ofa transistor can be distinguished from each other to specify thetechnical scope.

Other examples of the expression are as follows: “a source (or a firstterminal or the like) of a transistor is electrically connected to Xthrough at least a first connection path, the first connection path doesnot include a second connection path, the second connection path is apath between the source (or the first terminal or the like) of thetransistor and a drain (or a second terminal or the like) of thetransistor through the transistor, the first connection path is a paththrough which Z1 is provided, the drain (or the second terminal or thelike) of the transistor is electrically connected to Y through at leasta third connection path, the third connection path does not include thesecond connection path, and the third connection path is a path throughwhich Z2 is provided”; “a source (or a first terminal or the like) of atransistor is electrically connected to X at least with a firstconnection path through Z1, the first connection path does not include asecond connection path, the second connection path includes a connectionpath through which the transistor is provided, a drain (or a secondterminal or the like) of the transistor is electrically connected to Yat least with a third connection path through Z2, and the thirdconnection path does not include the second connection path”; and “asource (or a first terminal or the like) of a transistor is electricallyconnected to X at least with a first electrical path through Z1, thefirst electrical path does not include a second electrical path, thesecond electrical path is an electrical path from the source (or thefirst terminal or the like) of the transistor to a drain (or a secondterminal or the like) of the transistor, the drain (or the secondterminal or the like) of the transistor is electrically connected to Yat least with a third electrical path through Z2, the third electricalpath does not include a fourth electrical path, and the fourthelectrical path is an electrical path from the drain (or the secondterminal or the like) of the transistor to the source (or the firstterminal or the like) of the transistor”. When the connection path in acircuit configuration is defined by an expression similar to the aboveexamples, a source (or a first terminal or the like) and a drain (or asecond terminal or the like) of a transistor can be distinguished fromeach other to specify the technical scope.

Note that these expressions are examples and there is no limitation onthe expressions. Here, X, Y, Z1, and Z2 each denote an object (e.g., adevice, an element, a circuit, a wiring, an electrode, a terminal, aconductive film, and a layer).

Even when independent components are electrically connected to eachother in a circuit diagram, one component has functions of a pluralityof components in some cases. For example, when part of a wiring alsofunctions as an electrode, one conductive film functions as the wiringand the electrode. Thus, “electrical connection” in this specificationincludes in its category such a case where one conductive film hasfunctions of a plurality of components.

<1. Configuration Example of Display Device>

A display device of one embodiment of the present invention is describedwith reference to FIG. 1A. In FIG. 1A, part of the display device isillustrated. FIG. 1A illustrates a scan line 10 in which a selectionsignal (Sel) or a non-selection signal (n-Sel) is input to one end, anda transistor 11 in which a clock signal (CK) is input to a gate and thenon-selection signal (n-Sel) is input to a source. The other end of thescan line 10 is connected to a drain of the transistor 11. In FIG. 1A, asignal is input to the scan line 10 so that the signal input from theone end is switched from the selection signal (Sel) to the non-selectionsignal (n-Sel) at the same or substantially the same time as thetransistor 11 is turned on. Although an n-channel transistor isillustrated as the transistor 11 in FIG. 1A, the transistor 11 may be ap-channel transistor.

In an actual display device, the scan line 10 is connected to gates oftransistors included in a plurality of pixels arranged in one specificrow. In FIG. 1B, pixels 12_1 and 12_2 and transistors 13_1 and 13_2included in the pixels 12_1 and 12_2, respectively (hereinafter suchtransistors are referred to as pixel transistors) are included in theconfiguration illustrated in FIG. 1A. When the transistors 13_1 and 13_2are n-channel transistors as illustrated in FIG. 1B, a high power supplypotential (VDD) is the selection signal and a low power supply potential(VSS) is the non-selection signal. FIG. 1C illustrates an example ofwaveforms of the signals in FIG. 1B. As illustrated in FIG. 1C, a signalis input to the scan line 10 in FIG. 1B so that a timing (TA) at whichthe signal input to one end is switched from the high power supplypotential (VDD) to the low power supply potential (VSS) corresponds to atiming at which the clock signal (CK) is switched from the low powersupply potential (VSS) to the high power supply potential (VDD). Notethat although the clock signal (CK) alternates between the high powersupply potential (VDD) and the low power supply potential (VSS) and hasa duty ratio of 1/2 in FTG. 1C, at least one of the high power supplypotential (VDD) and the low power supply potential (VSS) may besubstituted with another potential, and a duty ratio of the signal maybe other than 1/2.

As illustrated in FIG. 1C, in a period during which the high powersupply potential (VDD) is supplied to the scan line 10, the transistor11 is preferably kept in an off state. That is, in the period, the clocksignal (CK) is preferably kept at the low power supply potential (VSS).This makes is possible to inhibit flow of a wasted current from the oneend to the other end of the scan line 10; thus, increase in malfunctionand power consumption can be inhibited in the display device.

FIG. 1D illustrates a configuration in which the transistors 11, 13_1,and 13_2 in FIG. 1B are substituted with p-channel transistors 14, 15_1,and 15_2. In this case, the high power supply potential (VDD) is thenon-selection signal, and the low power supply potential (VSS) is theselection signal. FIG. 1E illustrates an example of waveforms of thesignals in FIG. 1D. As illustrated in FIG. 1E, a signal is input to thescan line 10 in FIG. 1D so that a timing (TB) at which the signal inputfrom the one end is switched from the low power supply potential (VSS)to the high power supply potential (VDD) corresponds to a timing atwhich the clock signal (CK) is switched from the high power supplypotential (VDD) to the low power supply potential (VSS).

Note that as illustrated in FIG. 1B, the transistor 11 whose drain isconnected to the other end of the scan line 10 and the transistors 13_1and 13_2 whose gates are connected to the scan line 10 preferably havethe same polarity; as illustrated in FIG. 1D, the transistor 14 whosedrain is connected to the other end of the scan line 10 and thetransistors 15_1 and 15_2 whose gates are connected to the scan line 10preferably have the same polarity. Specifically, the number ofmanufacturing steps can be small as compared to the case where thetransistor 11 has different polarity from the transistors 13_1 and 13_2or the case where the transistor 14 has different polarity from thetransistors 15_1 and 15_2, which is preferable. In the case where thetransistor 11 has different polarity from the transistors 13_1 and 13_2,the transistor 14 has different polarity from the transistors 15_1 and15_2, and the clock signal (CK) has a potential corresponding to theselection signal and a potential corresponding to the non-selectionsignal, the non-selection signal is input not to the source but to thedrain of the transistor 11 or 14. In this case, to a gate of atransistor that is connected to the scan line 10, not a potentialcorresponding to the non-selection signal but a potential which changesfrom the potential corresponding to the non-selection signal by thethreshold voltage of the transistor 11 or 14 is input.

FIG. 2A illustrates part of a display device of one embodiment of thepresent invention. FIG. 2A illustrates a scan line 101 to which a signal(A1) is input from the left side, a scan line 102 to which a signal (A2)is input from the right side, a transistor 111 in which a clock signal(CK2) is input to a gate and the low power supply potential (VSS) isinput to a source, and a transistor 112 in which a clock signal (CK1) isinput to a gate and the low power supply potential (VSS) is input to asource. One end of the scan line 101 on the right side is connected to adrain of the transistor 111, and one end of the scan line 102 on theleft side is connected to a drain of the transistor 112. FIG. 2A alsoillustrates pixels 121_1, 121_2, 122_1, and 122_2 and transistors 131_1,131_2, 132_1, and 132_2. Note that the transistors 111, 112, 131_1,131_2, 132_1, and 132_2 are n-channel transistors.

FIG. 2B illustrates waveforms of the signals in FIG. 2A. As illustratedin FIG. 2B, the signals are input to the scan lines 101 and 102 in FIG.2A so that timings (TA1 and TA2) at which the input signals are switchedfrom the high power supply potential (VDD) to the low power supplypotential (VSS) correspond to timings at which the clock signals (CK1and CK2) are switched from the low power supply potential (VSS) to thehigh power supply potential (VDD). Note that the duty ratio or the likeof the clock signals (CK1 and CK2) can be changed as appropriate.

In the case of the configuration as illustrated in FIG. 2A, wiringsserving as input paths of the clock signals (CK1 and CK2) are notnecessarily provided collectively on one side of a display region, andcan be separately provided on both sides to face each other. Thus, it ispossible to reduce the frame width of a display device including adisplay region at the center (to achieve a narrowed frame width).

Note that although the transistors included in the display device arethe n-channel transistors in FIGS. 2A and 2B, the transistors may bep-channel transistors.

In FIG. 3, a shift register 141 is provided on the left side of theconfiguration illustrated in FIG. 2A and a shift register 142 isprovided on the right side thereof. Note that the shift register 141 isa circuit to which the clock signal (CK1) is input and which outputs asignal to the scan line 101. The shift register 142 is a circuit towhich the clock signal (CK2) is input and which outputs a signal to thescan line 102.

In the configuration of FIG. 3, as in the configuration of FIG. 2A, anarrowed frame width can be achieved. In the configuration of FTG. 3,the clock signals (CK1 and CK2) are used not only to control switchingof the transistors 111 and 112 but also to operate the shift registers141 and 142. Consequently, it is possible to achieve a narrowed framewidth efficiently in the configuration of FIG. 3.

Note that there is no particular limitation on the structures of theshift registers 141 and 142. For example, the shift registers 141 and142 may each include a complementary metal oxide semiconductor (CMOS)circuit using both a p-channel transistor and an n-channel transistor,or may each include the p-channel transistor or the n-channeltransistor. In the case where the shift registers 141 and 142 eachinclude a CMOS circuit, power consumption of the shift registers 141 and142 can be reduced, which is preferable. In the case where the shiftregisters 141 and 142 each include transistors with the same polarity asthe transistors 111, 112, 131_1, 131_2, 132_1, and 132_2, the number ofmanufacturing steps can be reduced, which is preferable.

<2. Specific Example of Display Device>

FIG. 4A illustrates a specific example of the display device. A displaydevice in FIG. 4A includes m×n pixels 20 arranged in m rows and ncolumns (m and n are even numbers), m scan lines 21 extending in thehorizontal direction in FIG. 4A between the pixels, n signal lines 22extending in the vertical direction in FIG. 4A between the pixels, scanline driver circuits 23 and 24 each of which is connected to the m scanlines 21, and a signal line driver circuit 25 connected to the n signallines 22.

<(1) Configuration Example of Pixel 20>

FIG. 4B is an example of a circuit diagram of the pixel 20 included inthe display device illustrated in FIG. 4A. The pixel 20 in FIG. 4Bincludes a transistor 201, a capacitor 202, and a liquid crystal element203. A gate of the transistor 201 is electrically connected to the scanline 21, and one of a source and a drain of the transistor 201 iselectrically connected to the signal line 22. One electrode of thecapacitor 202 is electrically connected to the other of the source andthe drain of the transistor 201, and the other electrode of thecapacitor 202 is electrically connected to a wiring for supplying acapacitor potential (the wiring is also referred to as a capacitorwiring). One electrode of the liquid crystal element 203 is electricallyconnected to the other of the source and the drain of the transistor 201and the one electrode of the capacitor 202, and the other electrode ofthe liquid crystal element 203 is electrically connected to a wiring forsupplying a common potential (the wiring is also referred to as a commonpotential line). The capacitor potential and the common potential can bethe same potential. Although the liquid crystal element 203 is providedin the pixel 20 in FIG. 4B, the structure of the pixel in the displaydevice disclosed in this specification is not limited to this structure.For example, it is possible to provide a light-emitting element in thepixel in the display device disclosed in this specification.

<(2) Configuration Examples of Scan Line Driver Circuits 23 and 24>

FIG. 5 illustrates configuration examples of the scan line drivercircuits 23 and 24 included in the display device in FIG. 4A. The scanline driver circuit 23 in FIG. 5 includes four wirings each of whichsupplies any of clock signals (CKL1 to CKL4); a plurality of pulseoutput circuits 23_1, 23_3 . . . , and 23_m−1 each of which is connectedto any one of a plurality of scan lines 21_1, 21_3 . . . , and 21_m−1arranged in the odd-numbered rows; and a plurality of transistors 23_2,23_4 . . . , and 23_m in each of which a gate is connected to any one ofthe four wirings, a source is connected to a wiring for supplying thelow power supply potential (VSS) (hereinafter the wiring is alsoreferred to as a low power supply potential line), and a drain isconnected to any one of a plurality of scan lines 21_2, 21_4 . . . , and21_m arranged in the even-numbered rows. The scan line driver circuit 24in FIG. 5 includes four wirings each of which supplies any one of clocksignals (CKR1 to CKR4); a plurality of pulse output circuits 24_2, 24_4. . . , and 24_m each of which is connected to any one of the pluralityof scan lines 21_2, 21_4 . . . , and 21_m−1 arranged in theeven-numbered rows; and a plurality of transistors 24_1, 24_3 . . . ,and 24_m−1 in each of which a gate is connected to any one of the fourwirings, a source is connected to the low power supply potential line,and a drain is connected to any one of the plurality of scan lines 21_1,21_3 . . . , and 21_m−1 arranged in the odd-numbered rows. Note that inthe scan line driver circuit 23 in FIG. 5, a shift register is composedof the pulse output circuits 23_1, 23_3 . . . , and 23_m−1, and in thescan line driver circuit 24 in FIG. 5, a shift register is composed ofthe pulse output circuits 24_2, 24_4 . . . , and 24_m.

FIG. 6A illustrates a specific example of the waveforms of the clocksignals (CKL1 to CKL4 and CKR1 to CKR4). The clock signal (CKL1) in FIG.6A periodically alternates between a high-level potential (the highpower supply potential (VDD)) and a low-level potential (the low powersupply potential (VSS)), and has a duty ratio of 3/8. The phase of theclock signal (CKL2) is shifted from the clock signal (CKL1) by ¼ period,the phase of the clock signal (CKL3) is shifted from the clock signal(CKL1) by ½ period, and the phase of the clock signal (CKL4) is shiftedfrom the clock signal (CKL1) by ¾ period. The phase of the clock signal(CKR1) is shifted from the clock signal (CKL1) by ⅛ period, the phase ofthe clock signal (CKR2) is shifted from the clock signal (CKL1) by ⅜period, the phase of the clock signal (CKR3) is shifted from the clocksignal (CKL1) by ⅝ period, and the phase of the clock signal (CKR4) isshifted from the clock signal (CKL1) by ⅞ period.

In the above-described display device, circuits with the sameconfiguration can be used as the pulse output circuits 23_1, 23_3 . . ., and 23_m−1 and the pulse output circuits 24_2, 24_4 . . . , and 24_m.However, electrical connections of a plurality of terminals aredifferent in the pulse output circuits. Specific connection relation isdescribed with reference to FIG. 5 and FIG. 6B.

Other than the pulse output circuits 23_m−1 and 24_m, the pulse outputcircuits each include terminals 31 to 36. Note that the terminals 31 to34 are input terminals, and the terminals 35 and 36 are outputterminals. The pulse output circuits 23_m−1 and 24_m each include theterminals 31 to 35.

First, the terminal 31 is described. The terminal 31 of the pulse outputcircuit 23_1 is connected to a wiring for supplying a start pulse (SP1),and the terminal 31 of the pulse output circuit 23_2 a−1 (a is a naturalnumber of 2 or more and m/2 or less) is connected to the terminal 36 ofthe pulse output circuit 23_2 a−3. The terminal 31 of the pulse outputcircuit 24_2 is connected to a wiring for supplying a start pulse (SP2),and the terminal 31 of the pulse output circuit 24_2 a is connected tothe terminal 36 of the pulse output circuit 24_2 a−2.

Next, the terminal 32 is described. The terminal 32 of the pulse outputcircuit 23_8 b−7 (b is a natural number of m/8 or less) is connected tothe wiring for supplying the clock signal (CKL1), the terminal 32 of thepulse output circuit 23_8 b−5 is connected to the wiring for supplyingthe clock signal (CKL2), the terminal 32 of the pulse output circuit23_8 b−3 is connected to the wiring for supplying the clock signal(CKL3), and the terminal 32 of the pulse output circuit 23_8 b−1 isconnected to the wiring for supplying the clock signal (CKL4). Theterminal 32 of the pulse output circuit 24_8 b−6 is connected to thewiring for supplying the clock signal (CKR1), the terminal 32 of thepulse output circuit 24_8 b−4 is connected to the wiring for supplyingthe clock signal (CKR2), the terminal 32 of the pulse output circuit24_8 b−2 is connected to the wiring for supplying the clock signal(CKR3), and the terminal 32 of the pulse output circuit 24_8 b isconnected to the wiring for supplying the clock signal (CKR4).

Next, the terminal 33 is described. The terminal 33 of the pulse outputcircuit 23_8 b−7 is connected to the wiring for supplying the clocksignal (CKL2), the terminal 33 of the pulse output circuit 23_8 b−5 isconnected to the wiring for supplying the clock signal (CKL3), theterminal 33 of the pulse output circuit 23_8 b−3 is connected to thewiring for supplying the clock signal (CKL4), and the terminal 33 of thepulse output circuit 23_8 b−1 is connected to the wiring for supplyingthe clock signal (CKL1). The terminal 33 of the pulse output circuit24_8 b−6 is connected to the wiring for supplying the clock signal(CKR2), the terminal 33 of the pulse output circuit 24_8 b−4 isconnected to the wiring for supplying the clock signal (CKR3), theterminal 33 of the pulse output circuit 24_8 b−2 is connected to thewiring for supplying the clock signal (CKR4), and the terminal 33 of thepulse output circuit 24_8 b is connected to the wiring for supplying theclock signal (CKR1).

Next, the terminal 34 is described. The terminal 34 of the pulse outputcircuit 23_8 b−7 is connected to the wiring for supplying the clocksignal (CKL3), the terminal 34 of the pulse output circuit 23_8 b−5 isconnected to the wiring for supplying the clock signal (CKL4), theterminal 34 of the pulse output circuit 23_8 b−3 is connected to thewiring for supplying the clock signal (CKL1), and the terminal 34 of thepulse output circuit 23_8 b−1 is connected to the wiring for supplyingthe clock signal (CKL2). The terminal 34 of the pulse output circuit24_8 b−6 is connected to the wiring for supplying the clock signal(CKR3), the terminal 34 of the pulse output circuit 24_8 b−4 isconnected to the wiring for supplying the clock signal (CKR4), theterminal 34 of the pulse output circuit 24_8 b−2 is connected to thewiring for supplying the clock signal (CKR1), and the terminal 34 of thepulse output circuit 24_8 b is connected to the wiring for supplying theclock signal (CKR2).

Next, the terminal 35 is described. The terminal 35 of each of the pulseoutput circuits 23_2 x−1 and 24_2 x (x is a natural number less than orequal to m) is connected to the scan line 21_x arranged in the x-th row.

The connection relation of the terminals 36 of the pulse output circuits(excluding the pulse output circuits 23_m−1 and 24_m) is describedabove. Therefore, the above description is to be referred to.

<(2-1) Configuration Example of Pulse Output Circuit>

FIG. 7A illustrates a configuration example of the pulse output circuitsillustrated in FIGS. 5 and 6B. A pulse output circuit in FIG. 7Aincludes transistors 41 to 49. Note that the transistors 43 and 44 arenot necessarily provided in each of the pulse output circuits 23_m−1 and24_m.

One of a source and a drain of the transistor 41 is electricallyconnected to a wiring for supplying the high power supply potential(VDD) (hereinafter also referred to as a high power supply potentialline). A gate of the transistor 41 is electrically connected to theterminal 31.

One of a source and a drain of the transistor 42 is connected to the lowpower supply potential line, and the other of the source and the drainof the transistor 42 is connected to the other of the source and thedrain of the transistor 41.

One of a source and a drain of the transistor 43 is connected to theterminal 32; the other of the source and the drain of the transistor 43is connected to the terminal 36; and a gate of the transistor 43 isconnected to the other of the source and the drain of the transistor 41and the other of the source and the drain of the transistor 42.

One of a source and a drain of the transistor 44 is connected to the lowpower supply potential line. The other of the source and the drain ofthe transistor 44 is connected to the terminal 36. A gate of thetransistor 44 is connected to a gate of the transistor 42.

One of a source and a drain of the transistor 45 is connected to the lowpower supply potential line. The other of the source and the drain ofthe transistor 45 is connected to the gate of the transistor 42 and thegate of the transistor 44. A gate of the transistor 45 is connected tothe terminal 31.

One of a source and a drain of the transistor 46 is connected to thehigh power supply potential line; and a gate of the transistor 46 isconnected to the terminal 33. Note that it is possible to employ astructure in which one of the source and the drain of the transistor 46is connected to a wiring for supplying a power supply potential (VCC)which is higher than the low power supply potential (VSS) and lower thanthe high power supply potential (VDD).

One of a source and a drain of the transistor 47 is connected to theother of the source and the drain of the transistor 46; the other of thesource and the drain of the transistor 47 is connected to the gate ofthe transistor 42, the gate of the transistor 44, and the other of thesource and the drain of the transistor 45; and a gate of the transistor47 is connected to the terminal 34.

One of a source and a drain of the transistor 48 is connected to theterminal 32; the other of the source and the drain of the transistor 48is connected to the terminal 35; and a gate of the transistor 48 isconnected to the other of the source and the drain of the transistor 41,the other of the source and the drain of the transistor 42, and the gateof the transistor 43.

One of a source and a drain of the transistor 49 is connected to the lowpower supply potential line; the other of the source and the drain ofthe transistor 49 is connected to the terminal 35; and a gate of thetransistor 49 is connected to the gate of the transistor 42, the gate ofthe transistor 44, the other of the source and the drain of thetransistor 45, and the other of the source and the drain of thetransistor 47.

In the following description, a node where the other of the source andthe drain of the transistor 41, the other of the source and the drain ofthe transistor 42, the gate of the transistor 43, and the gate of thetransistor 48 are connected to each other is referred to as a node A; anode where the gate of the transistor 42, the gate of the transistor 44,the other of the source and the drain of the transistor 45, the other ofthe source and the drain of the transistor 47, and the gate of thetransistor 49 are connected to each other is referred to as a node B.

<(2-2) Operation Example of Pulse Output Circuit>

An operation example of the above-described pulse output circuit isdescribed with reference to FIGS. 7B and 7C. FIG. 7B illustrates thewaveforms of the signals input and output to/from the pulse outputcircuit 23_1, and the potentials of nodes A and B in the pulse outputcircuit 23_1. FIG. 7C illustrates the waveforms of the signals input andoutput to/from the pulse output circuit 24_2, and the potentials ofnodes A and B in the pulse output circuit 24_2. Note that in FIGS. 7Band 7C, Gout represents an output signal from the pulse output circuitto the scan line, and SRout represents an output signal from the pulseoutput circuit to the subsequent-stage pulse output circuit.

First, the operation of the pulse output circuit 23_1 is described withreference to FIG. 7B.

At a timing t1, the high-level potential (the high power supplypotential (VDD)) is input to the terminal 31. Accordingly, thetransistors 41 and 45 are on. Thus, the potential of the node A israised to the high-level potential (a potential lower than the highpower supply potential (VDD) by the threshold voltage of the transistor41); at this time, the transistor 41 is turned off. In addition, thepotential of the node B is lowered to the low power supply potential(VSS); consequently, the transistors 43 and 48 are turned on, and thetransistors 42, 44, and 49 are turned off. In the above manner, a signalinput to the terminal 32 is output from the terminals 35 and 36. Here,the signal input to the terminal 32 has the low-level potential (the lowpower supply potential (VSS)). Therefore, the pulse output circuit 23_1outputs the low-level potential (the low power supply potential (VSS))to the terminal 31 of the pulse output circuit 23_3 and the scan line21_1.

At a timing t2, the low-level potential (the low power supply potential(VSS)) is input to the terminal 34. Note that the signals output fromthe terminal 35 and the terminal 36 do not change, and the pulse outputcircuit 23_1 outputs the low-level potential (the low power supplypotential (VSS)) to the terminal 31 of the pulse output circuit 23_3 andthe scan line 21_1.

At a timing t3, the high-level potential (high power supply potential(VDD)) is input to the terminal 32. Note that the potential of the nodeA (potential of the other of the source and the drain of the transistor41) is increased to a high-level potential (potential which is decreasedfrom the high power supply potential (VDD)) by the threshold voltage ofthe transistor 41) at the timing t3. Thus, the transistor 41 is off. Asthis time, the high-level potential (high power supply potential (VDD))is input to the terminal 32, whereby the potential of the node A(potentials of the gates of the transistors 43 and 48) is furtherincreased by capacitive coupling between the sources and the gates ofthe transistors 43 and 48 (bootstrap operation). Owing to thebootstrapping, the potential of the signals output from the terminals 35and 36 are not decreased from the high-level potential (high powersupply potential (VDD)) input to the terminal 32. Therefore, the pulseoutput circuit 23_1 outputs the high-level potential (the high powersupply potential (VDD)) to the terminal 31 of the pulse output circuit23_3 and the scan line 21_1.

At a timing t4, the low-level potential (the low power supply potential(VSS)) is input to the terminal 31; and at a timing t5, the high-levelpotential (the high power supply potential (VDD)) is input to theterminal 33. Note that the signals output from the terminal 35 and theterminal 36 do not change, and the pulse output circuit 23_1 outputs thehigh-level potential (the high power supply potential (VDD)) to theterminal 31 of the pulse output circuit 23_3 and the scan line 21_1.

At a timing t6, the low-level potential (the low power supply potential(VSS)) is input to the terminal 32. At this time, capacitive couplingbetween the sources and the gates of the transistors 43 and 48 lowersthe potential of the node A (the potentials of the gates of thetransistors 43 and 48) (i.e., bootstrap operation). Note that thepotential of the node A is kept at a high level. Accordingly, thetransistors 43 and 48 are kept in an on state. Thus, the signal input tothe terminal 32 is output from the terminals 35 and 36. That is, thepulse output circuit 23_1 outputs the low-level potential (the low powersupply potential (VSS)) to the terminal 31 of the pulse output circuit23_3 and the scan line 21_1.

At a timing t7, the high-level potential (the high power supplypotential (VDD)) is input to the terminal 34. In addition, thehigh-level potential (the high power supply potential (VDD)) is alsoinput to the terminal 33 at the timing t7. Accordingly, the transistors46 and 47 are turned on. Thus, the potential of the node B is raised tothe high-level potential (a potential lower than the high power supplypotential (VDD) by either of a higher threshold voltage of thetransistors 46 and 47). Thus, the transistors 42, 44, and 49 are turnedon; accordingly, the potential of the node A is lowered to the low-levelpotential (the low power supply potential (VSS)). Thus, the transistors43 and 48 are turned off. In the above mariner, at the timing t7,signals input to one of the source and the drain of each of thetransistors 44 and 49 are output from the terminals 35 and 36. Thesignals of course have the low power supply potential (VSS). Therefore,a signal output from the pulse output circuit 23_1 to the terminal 31 ofthe pulse output circuit 23_3 and the scan line 21_1 is kept at thelow-level potential (the low power supply potential (VSS)).

Next, the operation of the pulse output circuit 24_2 is described. Asillustrated in FIG. 7C, the pulse output circuit 24_2 is operated in thesame manner as the pulse output circuit 23_1. Note that the pulse outputcircuit 24_2 is operated with the clock signals (CKL1 to CKL4 and CKR1to CKR4) which are delayed from those in the case of the pulse outputcircuit 23_1 by one-eighth of the cycle of the clock signals.

<(2-3) Operation Example of Transistors 23_2 . . . , and 23_m andTransistors 24_1 . . . , and 24_m−1>

The operation of the transistors 23_2 . . . , and 23_m and transistors24_1 . . . , and 24_m−1 is described with reference to FIGS. 8A and 8B.FIG. 8A illustrates part of the configuration example of FIG. 5. FIG. 8Billustrates the waveforms of signals output from the pulse outputcircuits 23_1 and 24_2 to the scan lines 21_1 and 21_2 in FIGS. 7B and7C, and the clock signals (CKR2 and CKL3) input to the gates of thetransistors 23_2 and 24_1.

In the above-described display device, as illustrated in FIG. 8B, atiming (ta) at which the potential of a signal output from the pulseoutput circuit 23_1 to the scan line 21_1 is switched from thehigh-level potential (the high power supply potential (VDD)) to thelow-level potential (the low power supply potential (VSS)) correspondsto a timing at which the potential of the clock signal (CKR2) isswitched from the low-level potential (the low power supply potential(VSS)) to the high-level potential (the high power supply potential(VDD)). That is, the timing (ta) corresponds to a timing at which thetransistor 24_1 is turned on. Similar to the above, a timing (tb) atwhich the potential of a signal output from the pulse output circuit24_3 to the scan line 21_2 is switched from the high-level potential(the high power supply potential (VDD)) to the low-level potential (thelow power supply potential (VSS)) corresponds to a timing at which thetransistor 24_1 is turned on. Thus, in the above-described displaydevice, the non-selection signal is input not only to one end but toboth ends of the scan line at the same time. This makes it possible toinhibit the potentials of portions in the scan line from being changedat different times. That is, a plurality of transistors whose gates areconnected to the scan line is inhibited from being switched at differenttimes. Consequently, it is possible to reduce a problem that occurs inthe display device.

Furthermore, in the above-described display device, the clock signals(CKL1 to CKL4 and CKR1 to CKR4) which are used to operate the shiftregisters are used to control the switching of the transistors 23_2,23_4 . . . , and 23_m, and transistors 24_1, 24_3 . . . , and 24_m−1.That is, there is no need to provide another wiring for supplying asignal to control switching of the transistors 23_2, 23_4 . . . , and23_m, and transistors 24_1, 24_3 . . . , and 24_m−1. Thus, in theabove-described display device, a narrowed frame width can beefficiently achieved.

<(3) Modification Example of Scan Line Driver Circuits 23 and 24>

The scan line driver circuits 23 and 24 provided in the display devicedisclosed in this specification are not limited to the above-describedcircuits. For example, a configuration can be employed in which thegates of the transistors 23_2 . . . , and 23_m are each connected to theterminal 35 of any one of the pulse output circuits 23_1 . . . , and23_m−1 and the gates of the transistors 24_1 . . . , and 24_m−1 are eachconnected to the terminal 35 of any one of the pulse output circuits24_2 . . . , and 24 ₂ m−1, instead of the configuration of FIG. 5 inwhich the gates are each connected to any one of the wirings forsupplying the clock signals (CKL1 to CKL4 and CKR1 to CKR4).

Specifically, a configuration illustrated in FIG. 9 can be employed aslong as the pulse output circuits have the configuration illustrated inFIG. 7A. In the scan line driver circuit 23 in FIG. 9, the gate of thetransistor 23_2 c (c is an even number of m−4 or less) is connected tothe terminal 35 of the pulse output circuit 23_c+3, and the gate of thetransistor 24_d (d is an odd number of m−3 or less) is connected to theterminal 35 of the pulse output circuit 24_d+3. Although not illustratedin FIG. 9, the gate of the transistor 23_m−2 is connected to theterminal 35 of the pulse output circuit 23_m−7, the gate of thetransistor 23_m is connected to the terminal 35 of the pulse outputcircuit 23_m−5, and the gate of the transistor 24_m−1 is connected tothe terminal 35 of the pulse output circuit 24_m−6 in FIG. 9.

The use of the scan line driver circuits 23 and 24 in FIG. 9 exerts thesame effect as the use of the scan line driver circuits 23 and 24 inFIG. 5.

<3. Specific Examples of Transistor>

Any kind of transistor may be used as the transistors included in theabove-described display device. For example, a transistor in which achannel is formed in a silicon film (the transistor including a channelformation region in the silicon film) or a transistor in which a channelis formed in an oxide semiconductor film (the transistor including achannel formation region in the oxide semiconductor film) can be used asthe transistors included in the above-described display device.

A structure of the oxide semiconductor film is described below.

An oxide semiconductor film is classified roughly into a single-crystaloxide semiconductor film and a non-single-crystal oxide semiconductorfilm. The non-single-crystal oxide semiconductor film includes any of ac-axis aligned crystalline oxide semiconductor (CAAC-OS) film, apolycrystalline oxide semiconductor film, a microcrystalline oxidesemiconductor film, an amorphous oxide semiconductor film, and the like.

First, a CAAC-OS film is described.

The CAAC-OS film is an oxide semiconductor film having a plurality ofc-axis aligned crystal parts.

In a transmission electron microscope (TEM) image of the CAAC-OS film, aboundary between crystal parts, that is, a grain boundary is not clearlyobserved. Thus, in the CAAC-OS film, a reduction in electron mobilitydue to the grain boundary is less likely to occur.

According to the TEM image of the CAAC-OS film observed in a directionsubstantially parallel to a sample surface (cross-sectional TEM image),metal atoms are arranged in a layered manner in the crystal parts. Eachmetal atom layer has a morphology reflecting a surface over which theCAAC-OS film is formed (hereinafter, a surface over which the CAAC-OSfilm is formed is referred to as a formation surface) or a top surfaceof the CAAC-OS film, and is arranged in parallel to the formationsurface or the top surface of the CAAC-OS film.

In this specification, a term “parallel” indicates that the angle formedbetween two straight lines is greater than or equal to −10° and lessthan or equal to 10°, and accordingly also includes the case where theangle is greater than or equal to −5° and less than or equal to 5°. Inaddition, a term “perpendicular” indicates that an angle formed betweentwo straight lines is greater than or equal to 80° and less than orequal to 100°, and accordingly also includes the case where the angle isgreater than or equal to 85° and less than or equal to 95°.

According to the TEM image of the CAAC-OS film observed in a directionsubstantially perpendicular to the sample surface (plan TEM image),metal atoms are arranged in a triangular or hexagonal configuration inthe crystal parts. However, there is no regularity of arrangement ofmetal atoms between different crystal parts.

From the results of the cross-sectional TEM image and the plan TEMimage, alignment is found in the crystal parts in the CAAC-OS film.

Most of the crystal parts included in the CAAC-OS film each fit inside acube whose one side is less than 100 nm. Thus, there is a case where acrystal part included in the CAAC-OS film fits inside a cube whose oneside is less than 10 nm, less than 5 nm, or less than 3 nm. Note thatwhen a plurality of crystal parts included in the CAAC-OS film areconnected to each other, one large crystal region is formed in somecases. For example, a crystal region with an area of 2500 nm² or more, 5μm² or more, or 1000 μm² or more is observed in some cases in the planTEM image.

A CAAC-OS film is subjected to structural analysis with an X-raydiffraction (XRD) apparatus. For example, when the CAAC-OS filmincluding an InGaZnO₄ crystal is analyzed by an out-of-plane method, apeak appears frequently when the diffraction angle (2θ) is around 31°.This peak is derived from the (009) plane of the InGaZnO₄ crystal, whichindicates that crystals in the CAAC-OS film have c-axis alignment, andthat the c-axes are aligned in a direction substantially perpendicularto the formation surface or the top surface of the CAAC-OS film.

Furthermore, when the CAAC-OS film is analyzed by an in-plane method inwhich an X-ray enters a sample in a direction substantiallyperpendicular to the c-axis, a peak appears frequently when 2θ is around56°. This peak is derived from the (110) plane of the InGaZnO₄ crystal.Here, analysis (ϕ scan) is performed under conditions where the sampleis rotated around a normal vector of a sample surface as an axis (ϕaxis) with 2θ fixed at around 56°. In the case where the sample is asingle-crystal oxide semiconductor film of InGaZnO₄, six peaks appear.The six peaks are derived from crystal planes equivalent to the (110)plane. In contrast, in the case of a CAAC-OS film, a peak is not clearlyobserved even when ϕ scan is performed with 2θ fixed at around 56°.

According to the above results, in the CAAC-OS film, while thedirections of a-axes and b-axes are different between crystal parts, thec-axes are aligned in a direction parallel to a normal vector of aformation surface or a normal vector of a top surface. Thus, each metalatom layer arranged in a layered manner observed in the cross-sectionalTEM image corresponds to a plane parallel to the a-b plane of thecrystal.

Note that the crystal part is formed concurrently with deposition of theCAAC-OS film or is formed through crystallization treatment such as heattreatment. As described above, the c-axis of the crystal is aligned in adirection parallel to a normal vector of a formation surface or a normalvector of a top surface. Thus, for example, in the case where a shape ofthe CAAC-OS film is changed by etching or the like, the c-axis might notbe necessarily parallel to a normal vector of a formation surface or anormal vector of a top surface.

Distribution of c-axis aligned crystal parts in the CAAC-OS film is notnecessarily uniform. For example, in the case where crystal growthleading to the crystal parts of the CAAC-OS film occurs from thevicinity of the top surface of the film, the proportion of the c-axisaligned crystal parts in the vicinity of the top surface is higher thanthat in the vicinity of the formation surface in some cases. When animpurity is added to the CAAC-OS film, a region to which the impurity isadded is altered, and the proportion of the c-axis aligned crystal partsin the CAAC-OS film varies depending on regions, in some cases.

Note that when the CAAC-OS film with an InGaZna₄ crystal is analyzed byan out-of-plane method, a peak of 2θ may also be observed at around 36°,in addition to the peak of 2θ at around 31°. The peak of 2θ at around36° indicates that a crystal having no c-axis alignment is included inpart of the CAAC-OS film. It is preferable that in the CAAC-OS film, apeak of 2θ appear at around 31° and a peak of 2θ not appear at around36°.

The CAAC-OS film is an oxide semiconductor film having low impurityconcentration. The impurity is an element other than the main componentsof the oxide semiconductor film, such as hydrogen, carbon, silicon, or atransition metal element. In particular, an element that has a higherstrength of bonding to oxygen than that of a metal element included inthe oxide semiconductor film, such as silicon, disturbs the atomicarrangement of the oxide semiconductor film by depriving the oxidesemiconductor film of oxygen and causes a decrease in crystallinity.Further, a heavy metal such as iron or nickel, argon, carbon dioxide, orthe like has a large atomic radius (molecular radius), and thus disturbsthe atomic arrangement of the oxide semiconductor film and causes adecrease in crystallinity when it is contained in the oxidesemiconductor film. Note that the impurity contained in the oxidesemiconductor film might serve as a carrier trap or a carrier generationsource.

The CAAC-OS film is an oxide semiconductor film having a low density ofdefect states. In some cases, oxygen vacancies in the oxidesemiconductor film serve as carrier traps or serve as carrier generationsources when hydrogen is captured therein.

The state in which impurity concentration is low and density of defectstates is low (the number of oxygen vacancies is small) is referred toas a “highly purified intrinsic” or “substantially highly purifiedintrinsic” state. A highly purified intrinsic or substantially highlypurified intrinsic oxide semiconductor film has few carrier generationsources, and thus can have a low carrier density. Thus, a transistorusing the oxide semiconductor film rarely has negative threshold voltage(is rarely normally on). The highly purified intrinsic or substantiallyhighly purified intrinsic oxide semiconductor film has few carriertraps. Accordingly, the transistor including the oxide semiconductorfilm has little variation in electrical characteristics and highreliability. Electric charge trapped by the carrier traps in the oxidesemiconductor film takes a long time to be released, and might behavelike fixed electric charge. Thus, the transistor using the oxidesemiconductor film having high impurity concentration and a high densityof defect states has unstable electrical characteristics in some cases.

With the use of the CAAC-OS film in a transistor, variation in theelectrical characteristics of the transistor due to irradiation withvisible light or ultraviolet light is small.

Next, a microcrystalline oxide semiconductor film is described.

In an image obtained with the TEM, crystal parts cannot be found clearlyin the microcrystalline oxide semiconductor film in some cases. In mostcases, a crystal part in the microcrystalline oxide semiconductor filmis greater than or equal to 1 nm and less than or equal to 100 nm, orgreater than or equal to 1 nm and less than or equal to 10 nm. Amicrocrystal with a size greater than or equal to 1 nm and less than orequal to 10 nm, or a size greater than or equal to 1 nm and less than orequal to 3 nm is specifically referred to as nanocrystal (nc). An oxidesemiconductor film including nanocrystal is referred to as an nc-OS(nanocrystalline oxide semiconductor) film. In an image obtained withTEM, a crystal boundary cannot be found clearly in the nc-OS film insome cases.

In the nc-OS film, a microscopic region (for example, a region with asize greater than or equal to 1 nm and less than or equal to 10 nm, inparticular, a region with a size greater than or equal to 1 nm and lessthan or equal to 3 nm) has a periodic atomic arrangement. Note thatthere is no regularity of crystal orientation between different crystalparts in the nc-OS film. Thus, the orientation of the whole film is notobserved. Accordingly, in some cases, the nc-OS film cannot bedistinguished from an amorphous oxide semiconductor depending on ananalysis method. For example, when the nc-OS film is subjected tostructural analysis by an out-of-plane method with an XRD apparatususing an X-ray having a diameter larger than that of a crystal part, apeak which shows a crystal plane does not appear. Further, a halopattern is shown in a selected-area electron diffraction pattern of thenc-OS film obtained by using an electron beam having a probe diameterlarger than the diameter of a crystal part (e.g., larger than or equalto 50 nm). Meanwhile, spots are shown in a nanobeam electron diffractionpattern of the nc-OS film obtained by using an electron beam having aprobe diameter (e.g., larger than or equal to 1 nm and smaller than orequal to 30 nm) close to, or smaller than or equal to the diameter of acrystal part. Further, in a nanobeam electron diffraction pattern of thenc-OS film, regions with high luminance in a circular (ring) pattern areobserved in some cases. Also in a nanobeam electron diffraction patternof the nc-OS film, a plurality of spots are shown in a ring-like regionin some cases.

The nc-OS film is an oxide semiconductor film that has higher regularitythan an amorphous oxide semiconductor film. Therefore, the nc-OS filmhas a lower density of defect states than an amorphous oxidesemiconductor film. However, there is no regularity of crystalorientation between different crystal parts in the nc-OS film; hence,the nc-OS film has a higher density of defect states than the CAAC-OSfilm.

Note that an oxide semiconductor film may be a stacked film includingtwo or more of an amorphous oxide semiconductor film, a microcrystallineoxide semiconductor film, and a CAAC-OS film, for example.

<4. Specific Example of Display Module>

A display module including the above-described display device as acomponent is described below with reference to FIG. 10.

In a display module 8000 illustrated in FIG. 10, a touch panel 8004connected to an FPC 8003, a display panel 8006 connected to an FPC 8005,a backlight unit 8007, a frame 8009, a printed board 8010, and a battery8011 are provided between an upper cover 8001 and a lower cover 8002.Note that as the structure of the display module, a structure can alsobe employed in which at least one of these components is not provided(e.g., the backlight unit 8007, the battery 8011, or the touch panel8004 is not provided).

The above-described display device corresponds to the display panel8006.

The shapes and sizes of the upper cover 8001 and the lower cover 8002can be changed as appropriate in accordance with the sizes of the touchpanel 8004 and the display panel 8006.

The touch panel 8004 is a resistive touch panel or a capacitive touchpanel and overlaps with the display panel 8006. A counter substrate(sealing substrate) of the display panel 8006 can have a touch panelfunction. A photosensor may be provided in each pixel of the displaypanel 8006 so that the touch panel 8004 can function as an optical touchpanel. An electrode for a touch sensor may be provided in each pixel ofthe display panel 8006 so that a capacitive touch panel is obtained.

The backlight unit 8007 includes a plurality of light sources 8008arranged in matrix. Note that the backlight unit 8007 may have astructure including a linear light source and a light diffusing plate.In this case, in the backlight unit 8007, linear light from the linearlight source is diffused by the light diffusion plate and emitted asplane light.

The frame 8009 protects the display panel 8006 and functions as anelectromagnetic shield for blocking electromagnetic waves generated bythe operation of the printed board 8010. The frame 8009 can function asa radiator plate.

The printed board 8010 is provided with a power supply circuit and asignal processing circuit for outputting a video signal and a clocksignal. As a power source for supplying power to the power supplycircuit, an external commercial power source or a power source using thebattery 8011 provided separately may be used. The battery 8011 can beomitted in the case of using a commercial power source.

The display module 8000 may be additionally provided with a member suchas a polarizing plate, a retardation plate, or a prism sheet.

<5. Specific Examples of End Product>

Examples of an end product including the above-described display deviceare described below with reference to FIGS. 11A and 11B and 12A and 12B.

Examples of the end product include television devices (also referred toas TVs or television receivers), monitors for computers and the like,cameras such as digital cameras and digital video cameras, digital photoframes, mobile phones (also referred to as cellular phones or portabletelephone devices), portable game machines, portable informationterminals, audio reproducing devices, and large game machines such aspachinko machines. Note that these end products can have a curveddisplay surface or a display surface that can be folded arbitrarily.

FIG. 11A illustrates an example of a mobile phone. A mobile phone 7400includes a display portion 7402 incorporated in a housing 7401, anoperation button 7403, an external connection port 7404, a speaker 7405,a microphone 7406, and the like. Note that in the mobile phone 7400, theabove-described display device is incorporated in the display portion7402.

The surface of the display portion 7402 of the mobile phone 7400 in FIG.11A is touched with a finger or the like to operate the mobile phone,for example, to change a displayed image. Operations such as making acall and inputting a letter can be also performed by touch on thesurface of the display portion 7402 with a finger or the like.

With the operation button 7403, start-up and shutdown of the mobilephone 7400 and the above-described operation can be performed.

FIG. 11B illustrates an example of a bangle display device. A bangledisplay device 7100 includes a housing 7101, a display portion 7102,operation buttons 7103, and a sending and receiving device 7104. Notethat in the bangle display device 7100, the above-described displaydevice is incorporated in the display portion 7102.

The bangle display device 7100 can receive a video signal with thesending and receiving device 7104 and can display the received video onthe display portion 7102. In addition, with the sending and receivingdevice 7104, the bangle display device 7100 can send and receive anaudio signal to/from another sending and receiving device.

With the operation buttons 7103, start-up and shutdown of the bangledisplay device 7100, operation such as changing a displayed image,adjusting volume, and the like can be performed.

FIG. 12A illustrates an example of a portable device. A portable device7300 includes a housing 7301, a display portion 7302, operation buttons7303, a display portion pull 7304, and a control portion 7305. Note thatin the portable device 7300, the above-described display device isincorporated in the display portion 7302.

In the portable device 7300, the flexible display portion 7302 is rolledand included in the cylindrical housing 7301. The display portion 7302includes a first substrate provided with a light-blocking layer and thelike and a second substrate provided with a transistor and the like. Thedisplay portion 7302 is rolled so that the second substrate ispositioned against an inner wall of the housing 7301.

The portable device 7300 can receive a video signal with the controlportion 7305 and can display the received video on the display portion7302. In addition, a battery is included in the control portion 7305. Aconnector may be included in the control portion 7305 so that a videosignal or power can be directly supplied.

With the operation buttons 7303, start-up and shutdown of the portabledevice 7300, operation such as changing a displayed image, and the likecan be performed.

FIG. 12B illustrates a state in which the display portion 7302 is pulledout with the display portion pull 7304. Videos can be displayed on thedisplay portion 7302 in this state. The operation buttons 7303 on thesurface of the housing 7301 allow one-handed operation.

Note that a reinforcement frame may be provided for an edge portion ofthe display portion 7302 in order to prevent the display portion 7302from being curved when pulled out.

Note that in addition to this structure, a speaker may be provided forthe housing so that sound is output with an audio signal receivedtogether with a video signal.

This application is based on Japanese Patent Application serial no.2013-189539 filed with Japan Patent Office on Sep. 12, 2013, the entirecontents of which are hereby incorporated by reference.

What is claimed is:
 1. A display device comprising: a first scan linesupplied with only a first selection signal and a first non-selectionsignal; a second scan line supplied with only a second selection signaland a second non-selection signal; a first transistor; a secondtransistor; a first scan line driver circuit; a second scan line drivercircuit; and a pixel portion between the first scan line driver circuitand the second scan line driver circuit, wherein one of a source and adrain of the first transistor is electrically connected to one end ofthe first scan line, wherein one of a source and a drain of the secondtransistor is electrically connected to one end of the second scan line,wherein the first scan line driver circuit is electrically connected tothe other end of the first scan line, wherein the second scan linedriver circuit is electrically connected to the other end of the secondscan line, wherein the first scan line is configured such that the firstselection signal is not supplied from the one end of the first scanline, and wherein the second scan line is configured such that thesecond selection signal is not supplied from the one end of the secondscan line.
 2. The display device according to claim 1, wherein each ofthe first transistor and the second transistor comprises an oxidesemiconductor film comprising a channel formation region.
 3. The displaydevice according to claim 1, wherein a gate of the first transistor iselectrically connected to the second scan line driver circuit, andwherein a gate of the second transistor is electrically connected to thefirst scan line driver circuit.
 4. The display device according to claim1, wherein the first transistor is controlled by a first clock signal,and wherein the second transistor is controlled by a second clocksignal.
 5. A display device comprising: a first scan line supplied witha first selection signal and a first non-selection signal; a second scanline supplied with a second selection signal and a second non-selectionsignal; a first transistor configured to supply the first non-selectionsignal to the first scan line from one end of the first scan line; asecond transistor configured to supply the second non-selection signalto the second scan line from one end of the second scan line; a firstscan line driver circuit configured to supply the first selection signaland the first non-selection signal to the first scan line from the otherend of the first scan line; a second scan line driver circuit configuredto supply the second selection signal and the second non-selectionsignal to the second scan line from the other end of the second scanline; and a pixel portion between the first scan line driver circuit andthe second scan line driver circuit, wherein the first scan line isconfigured such that the first selection signal is not supplied from theone end of the first scan line, and wherein the second scan line isconfigured such that the second selection signal is not supplied fromthe one end of the second scan line.
 6. The display device according toclaim 5, wherein each of the first transistor and the second transistorcomprises an oxide semiconductor film comprising a channel formationregion.
 7. The display device according to claim 5, wherein a gate ofthe first transistor is electrically connected to the second scan linedriver circuit, and wherein a gate of the second transistor iselectrically connected to the first scan line driver circuit.
 8. Thedisplay device according to claim 5, wherein the first transistor iscontrolled by a first clock signal, and wherein the second transistor iscontrolled by a second clock signal.
 9. A display device comprising: afirst scan line supplied with a first selection signal and a firstnon-selection signal; a second scan line supplied with a secondselection signal and a second non-selection signal; a first transistorconfigured to supply the first non-selection signal to the first scanline from one end of the first scan line; a second transistor configuredto supply the second non-selection signal to the second scan line fromone end of the second scan line; a first scan line driver circuitcomprising: a third transistor configured to supply the first selectionsignal to the first scan line from the other end of the first scan line;and a fourth transistor configured to supply the first non-selectionsignal to the first scan line from the other end of the first scan line;a second scan line driver circuit; a fifth transistor configured tosupply the second selection signal to the second scan line from theother end of the second scan line; and a sixth transistor configured tosupply the second non-selection signal to the second scan line from theother end of the second scan line; and a pixel portion between the firstscan line driver circuit and the second scan line driver circuit,wherein the first scan line is configured such that the first selectionsignal is not supplied from the one end of the first scan line, andwherein the second scan line is configured such that the secondselection signal is not supplied from the one end of the second scanline.
 10. The display device according to claim 9, wherein each of thefirst transistor and the second transistor comprises an oxidesemiconductor film comprising a channel formation region.
 11. Thedisplay device according to claim 9, wherein a gate of the firsttransistor is electrically connected to the second scan line drivercircuit, and wherein a gate of the second transistor is electricallyconnected to the first scan line driver circuit.
 12. The display deviceaccording to claim 9, wherein the first transistor is controlled by afirst clock signal, and wherein the second transistor is controlled by asecond clock signal.